Autodesk celebrates its largest education milestone to date, reaching 150 million students and educators globally. For more ...

Market Research Future forecasts 20% annual growth driven by tech advancements, sustainability, and adoption across aerospace ...

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...

Discover Justin Bieber's 3D shoe, LEGO's AMUG Keynote, 3D printed aircraft fuselage, and more 3D printing news!

Can a 3D chip change AI forever? It can move data faster, uses less energy, and packs more power in less space. Find out more ...

D HBM-on-GPU design reaches record compute density for demanding AI workloadsPeak GPU temperatures exceeded 140°C without ...

This radiopaque material lets healthcare providers create patient-specific models with precise, tunable X-ray visibility for ...

Fitasy is set to transform the footwear industry with new technology that democratizes access to custom-fit shoes--improving comfort, reducing waste, saving customers money, and helping prevent common ...

Chennai startup Tvasta collaborates with CEPT University to advance 3D construction technology through innovative workshops and research initiatives.

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...