Forbes contributors publish independent expert analyses and insights. Global Thought Leader in Cybersecurity and Emerging Tech Examining the mesh between humans and machines provides insight into the ...

BISC is an ultra-thin neural implant that creates a high-bandwidth wireless link between the brain and computers. Its tiny single-chip design packs tens of thousands of electrodes and supports ...

Brain-computer interfaces (BCIs) are emerging as a groundbreaking technology that has the potential to revolutionize the way humans interact with machines. By bridging the gap between human cognition ...

Brain-computer interfaces will play a central role in defining how human intelligence and artificial intelligence fit together.

Researchers have conducted groundbreaking research on memristor-based brain-computer interfaces (BCIs). This research presents an innovative approach for implementing energy-efficient adaptive ...

Brain–computer interfaces are technologies that enable direct communication between brain activity and external devices, enabling researchers to monitor and interpret brain signals in real time. These ...

Brain–machine interfaces (BMIs) represent a transformative field at the intersection of neuroscience, engineering and computer science, allowing for direct communication between the brain and external ...

On Sunday’s episode of The Excerpt podcast: Brain-computer interfaces promise breakthroughs in restoring lost function and beyond. But they also raise ethical and societal questions about the linking ...

An important milestone for brain-computer interfaces has been achieved. A new peer-reviewed neuroscience study led by researchers at the University of California, Los Angeles (UCLA) demonstrates a ...

The brain-computer interface developer Precision Neuroscience has put forward a study detailing the experiences of its first human patients—showing its minimally invasive approach is capable of both ...

Fabrication process and actual image of the silicon-based neural microelectrode array. a 1800 μm thick double-polished silicon wafer. b Microneedle array root fabrication with etching. c Microneedle ...