Teradyne TER is benefiting from the growing demand for memory test solutions, particularly driven by advancements in AI applications and data center investments. In the third quarter of 2025, the ...

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (TER) (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of the Magnum 7H, a ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

TOKYO, Feb. 12, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

SPONSORED CONTENT Consider, for a moment, the current state of AI accelerators and datacenter GPUs. Now, try to imagine this landscape without Micron Technology’s entry into the High Bandwidth Memory ...

Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...

High bandwidth memory (HBM) chips have become a game changer in artificial intelligence (AI) applications by efficiently handling complex algorithms with high memory requirements. They became a major ...

We've discussed the capabilities and performance of HBM (High Bandwidth Memory) multiple times over the past six months, but a new report sheds light on the physical architecture and construction of ...

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...