JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...

AI training data sets are constantly growing, driving the need for hardware accelerators capable of handling terabyte-scale bandwidth. Among the array of memory technologies available, High Bandwidth ...

Samsung has officially announced its new HBM4 memory is one of the first to be 'commercially' shipped, ready for 13Gbps and ...

SAIMEMORY—founded in December 2024, and officially launched in June 2025—is a joint venture between SoftBank, Intel, and the University of Tokyo.

The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash (HBF) ...